Kit de pinzas de alta presicion para BGA y reballing. removedor electrico de pegamento oca OBS 1 (Lollipop)

Description

1 (Lollipop)

Compatible con Versiones: J730F (South Africa)

Idónea para soldar y desoldar los componentes SMD tales como SOIC

Video de instalación recomendado:

Compatible con Versiones:¬¨‚Ä† SM-N960F/DS (Global)

Kit de pinzas de alta presicion para BGA y reballing. removedor electrico de pegamento oca OBS 1 (Lollipop)

Exchange/Return Notes

We offer a 30-day return/exchange service after receiving.
Final sale items are not eligible for returns or exchanges.
To process your return/exchange, please contact us at [email protected]
Please click here for more details>>> Return & Exchange Policy